Electrodeposition of Intermetallics of Ag, Cu and Au with Sn

P. L. Cavallotti, M. Bestetti, L. Magagnin, L. Nobili, A. Vicenzo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Intermetallic phases obtained by electrodeposition can be different from those obtained by metallurgical methods. A typical case regards IB metals with tin. We studied the electrodeposition of silver, copper and gold alloys with tin from different baths, in order to understand the rules under which the different intermediate phases crystallize. In the case of the Ag-Sn system only one intermetallic phase is obtained from different baths, of approximate composition Ag3Sn, interpreted as an hexagonal close packed structure with c/a different from the metallurgical stable phase. For Cu and Au with Sn more intermediate phases are obtained: of these one is rich in Cu or Au, and may be attributed to an HCP phase; near equiatomic composition, a phase of the NiAs type is obtained, similar to the well known NiSn intermetallic phase; in the case of gold more intermetallics rich in tin are also obtained. The different behavior of these system is simply related to the sign of the enthalpy change for alloy formation. The differences from metallurgical system are related to the disappearing influence of long range order and to the vanishing effect of atomic size factor for electrochemical systems, giving as a result phases of higher symmetry.

Original languageEnglish
Title of host publicationAESF SUR/FIN 2000 Finishing Technology into the Millennium
Pages542-550
Number of pages9
Publication statusPublished - 2000
Externally publishedYes
EventAESF SUR/FIN 2000 'Finishing Technology into the Millennium' - Chicago, IL, United States
Duration: 26 Jun 200029 Jun 2000

Conference

ConferenceAESF SUR/FIN 2000 'Finishing Technology into the Millennium'
CountryUnited States
CityChicago, IL
Period26.6.0029.6.00

Fingerprint

Electrodeposition
Intermetallics
Tin
Gold Alloys
Silver alloys
Gold alloys
Copper alloys
Chemical analysis
Gold
Enthalpy
Metals

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

Cite this

Cavallotti, P. L., Bestetti, M., Magagnin, L., Nobili, L., & Vicenzo, A. (2000). Electrodeposition of Intermetallics of Ag, Cu and Au with Sn. In AESF SUR/FIN 2000 Finishing Technology into the Millennium (pp. 542-550)

Electrodeposition of Intermetallics of Ag, Cu and Au with Sn. / Cavallotti, P. L.; Bestetti, M.; Magagnin, L.; Nobili, L.; Vicenzo, A.

AESF SUR/FIN 2000 Finishing Technology into the Millennium. 2000. p. 542-550.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cavallotti, PL, Bestetti, M, Magagnin, L, Nobili, L & Vicenzo, A 2000, Electrodeposition of Intermetallics of Ag, Cu and Au with Sn. in AESF SUR/FIN 2000 Finishing Technology into the Millennium. pp. 542-550, AESF SUR/FIN 2000 'Finishing Technology into the Millennium', Chicago, IL, United States, 26.6.00.
Cavallotti PL, Bestetti M, Magagnin L, Nobili L, Vicenzo A. Electrodeposition of Intermetallics of Ag, Cu and Au with Sn. In AESF SUR/FIN 2000 Finishing Technology into the Millennium. 2000. p. 542-550
Cavallotti, P. L. ; Bestetti, M. ; Magagnin, L. ; Nobili, L. ; Vicenzo, A. / Electrodeposition of Intermetallics of Ag, Cu and Au with Sn. AESF SUR/FIN 2000 Finishing Technology into the Millennium. 2000. pp. 542-550
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