Abstract
The effect of the external heat flow density and thermal-physical characteristics of the material of the enclosure walls on the modes of energy, mass, and momentum transfer in a standard component of electronics or electronic equipment with a local heat source is numerically analyzed. The distributions of the streamlines and isotherms in the solution region which reflect the possibility of controlling the thermohydrodynamics in the gas cavity by choosing the corresponding parameters of the external flow and the wall material are obtained. The dependences for the average heat transfer coefficient on the internal surface of one of the vertical walls in the case of variations in the thermal-physical characteristics of the material and the wall thickness are obtained.
Original language | English |
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Pages (from-to) | 326-332 |
Number of pages | 7 |
Journal | Russian Microelectronics |
Volume | 40 |
Issue number | 5 |
DOIs | |
Publication status | Published - 1 Sep 2011 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Materials Chemistry
- Condensed Matter Physics