Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps

Research output: Contribution to journal › Article

Abstract

This study focuses on the influence of metallization thickness of ceramic substrates on reliability and lifetime of electronic power assemblies under high temperature cycling. The paper presents experimental and numerical results on different test vehicles with a number of DCB substrates with AlN ceramic and different copper thicknesses. It will be shown the influence of the DCB metallization on failure modes such as ceramic fracture and solder delamination under high temperature cycles. Finally, these samples will be compared with DCB substrates equipped with dimples and DAB substrates. Furthermore, the main factors that could increase the lifetime expectancy of power modules in such harsh environments will be identified.

Original language	English
Pages (from-to)	1766-1771
Number of pages	6
Journal	Microelectronics Reliability
Volume	46
Issue number	9-11
DOIs	https://doi.org/10.1016/j.microrel.2006.07.057
Publication status	Published - 1 Sep 2006
Externally published	Yes

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ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Cite this

Dupont, L., Khatir, Z., Lefebvre, S., & Bontemps, S. (2006). Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability, 46(9-11), 1766-1771. https://doi.org/10.1016/j.microrel.2006.07.057

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Access to Document

10.1016/j.microrel.2006.07.057