Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling

L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps

Research output: Contribution to journalArticle

79 Citations (Scopus)

Abstract

This study focuses on the influence of metallization thickness of ceramic substrates on reliability and lifetime of electronic power assemblies under high temperature cycling. The paper presents experimental and numerical results on different test vehicles with a number of DCB substrates with AlN ceramic and different copper thicknesses. It will be shown the influence of the DCB metallization on failure modes such as ceramic fracture and solder delamination under high temperature cycles. Finally, these samples will be compared with DCB substrates equipped with dimples and DAB substrates. Furthermore, the main factors that could increase the lifetime expectancy of power modules in such harsh environments will be identified.

Original languageEnglish
Pages (from-to)1766-1771
Number of pages6
JournalMicroelectronics Reliability
Volume46
Issue number9-11
DOIs
Publication statusPublished - 1 Sep 2006
Externally publishedYes

Fingerprint

Metallizing
assemblies
ceramics
cycles
Substrates
test vehicles
life (durability)
Temperature
failure modes
solders
Power electronics
Delamination
Soldering alloys
Failure modes
Copper
copper
electronics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. / Dupont, L.; Khatir, Z.; Lefebvre, S.; Bontemps, S.

In: Microelectronics Reliability, Vol. 46, No. 9-11, 01.09.2006, p. 1766-1771.

Research output: Contribution to journalArticle

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