Abstract
The aim of the research was to determine the effect of temperature on mechanical properties of a micromechanical gyroscope with the sensing element mounted on a silicon wafer, with the crystallographic orientation of (100) (110) (111). The research is of current relevancy since the metrological characteristics that depend on the eigenfrequencies over the full temperature range are to be controlled. The temperature-modal analysis of the micromechanical gyroscope model was performed with ANSYS program. The temperature dependence for eigenfrequencies was obtained. The dependence of the scale factor on temperature for the most temperature-independent variant of sensor positioning on the wafer was determined. The developed mathematical model was used to find the forms of the output oscillations of the gyroscope.
| Original language | English |
|---|---|
| Title of host publication | IOP Conference Series: Materials Science and Engineering |
| Publisher | Institute of Physics Publishing |
| Volume | 81 |
| Edition | 1 |
| DOIs | |
| Publication status | Published - 23 Apr 2015 |
| Event | International Scientific Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2014 - Tomsk, Russian Federation Duration: 3 Nov 2014 → 8 Nov 2014 |
Other
| Other | International Scientific Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2014 |
|---|---|
| Country | Russian Federation |
| City | Tomsk |
| Period | 3.11.14 → 8.11.14 |
Fingerprint
ASJC Scopus subject areas
- Engineering(all)
- Materials Science(all)
Cite this
Effect of the anisotropy of monocrystalline silicon mechanical properties on the dynamic characteristics of a micromechanical gyroscope. / Nesterenko, T. G.; Vtorushin, S. E.; Barbin, Evgenii Sergeevich; Koleda, Aleksei Nikolaevich.
IOP Conference Series: Materials Science and Engineering. Vol. 81 1. ed. Institute of Physics Publishing, 2015. 012096.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Effect of the anisotropy of monocrystalline silicon mechanical properties on the dynamic characteristics of a micromechanical gyroscope
AU - Nesterenko, T. G.
AU - Vtorushin, S. E.
AU - Barbin, Evgenii Sergeevich
AU - Koleda, Aleksei Nikolaevich
PY - 2015/4/23
Y1 - 2015/4/23
N2 - The aim of the research was to determine the effect of temperature on mechanical properties of a micromechanical gyroscope with the sensing element mounted on a silicon wafer, with the crystallographic orientation of (100) (110) (111). The research is of current relevancy since the metrological characteristics that depend on the eigenfrequencies over the full temperature range are to be controlled. The temperature-modal analysis of the micromechanical gyroscope model was performed with ANSYS program. The temperature dependence for eigenfrequencies was obtained. The dependence of the scale factor on temperature for the most temperature-independent variant of sensor positioning on the wafer was determined. The developed mathematical model was used to find the forms of the output oscillations of the gyroscope.
AB - The aim of the research was to determine the effect of temperature on mechanical properties of a micromechanical gyroscope with the sensing element mounted on a silicon wafer, with the crystallographic orientation of (100) (110) (111). The research is of current relevancy since the metrological characteristics that depend on the eigenfrequencies over the full temperature range are to be controlled. The temperature-modal analysis of the micromechanical gyroscope model was performed with ANSYS program. The temperature dependence for eigenfrequencies was obtained. The dependence of the scale factor on temperature for the most temperature-independent variant of sensor positioning on the wafer was determined. The developed mathematical model was used to find the forms of the output oscillations of the gyroscope.
UR - http://www.scopus.com/inward/record.url?scp=84930468780&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84930468780&partnerID=8YFLogxK
U2 - 10.1088/1757-899X/81/1/012096
DO - 10.1088/1757-899X/81/1/012096
M3 - Conference contribution
VL - 81
BT - IOP Conference Series: Materials Science and Engineering
PB - Institute of Physics Publishing
ER -