Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding

V. Durakov, S. Gnyusov, A. Schneider, S. Popov, V. Lavrinovich, A. Batrakov, B. Dampilon

Division for Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The microstructure and properties of the contact CuCr alloy produced by electron-beam cladding have been investigated. The effect of the electron beam cladding parameters and preheating temperature of the base metal on the structure and the properties of the coatings has been determined. The bimodal structure of the cladding coating has been established. The short circuit currents tests are made on the Weil-Dobke synthetic circuit simulating operation of a VCB in real electric networks. Test results showed that the cladding contact material has better breakdown strength after current zero than the sintered contact material in mass production. Application of the technology of electron beam cladding in the production of contact material would significantly improve a specific characteristics and the reliability of vacuum switching equipment.

Original language	English
Title of host publication	Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	525-528
Number of pages	4
ISBN (Print)	9781479967506
DOIs	https://doi.org/10.1109/DEIV.2014.6961735
Publication status	Published - 18 Nov 2014
Event	26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014 - Mumbai, India Duration: 28 Sep 2014 → 3 Oct 2014

Other

Other	26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014
Country	India
City	Mumbai
Period	28.9.14 → 3.10.14

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ASJC Scopus subject areas

Computer Networks and Communications
Software

Cite this

Durakov, V., Gnyusov, S., Schneider, A., Popov, S., Lavrinovich, V., Batrakov, A., & Dampilon, B. (2014). Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding. In Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV (pp. 525-528). [6961735] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DEIV.2014.6961735

Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding. / Durakov, V.; Gnyusov, S.; Schneider, A.; Popov, S.; Lavrinovich, V.; Batrakov, A.; Dampilon, B.

Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV. Institute of Electrical and Electronics Engineers Inc., 2014. p. 525-528 6961735.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Durakov, V, Gnyusov, S, Schneider, A, Popov, S, Lavrinovich, V, Batrakov, A & Dampilon, B 2014, Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding. in Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV., 6961735, Institute of Electrical and Electronics Engineers Inc., pp. 525-528, 26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014, Mumbai, India, 28.9.14. https://doi.org/10.1109/DEIV.2014.6961735

Durakov V, Gnyusov S, Schneider A, Popov S, Lavrinovich V, Batrakov A et al. Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding. In Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV. Institute of Electrical and Electronics Engineers Inc. 2014. p. 525-528. 6961735 https://doi.org/10.1109/DEIV.2014.6961735

Durakov, V. ; Gnyusov, S. ; Schneider, A. ; Popov, S. ; Lavrinovich, V. ; Batrakov, A. ; Dampilon, B. / Effect of substrate temperature on microstructure and properties of the CuCr25 alloys produced by electron beam cladding. Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 525-528

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Access to Document

10.1109/DEIV.2014.6961735