Effect of magnetic field configuration of dual magnetron on carbon based films properties

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The article reports on the influence of magnetic field (B field) configuration of dual magnetron on carbon based films properties. The films deposition was performed by means of magnetron sputtering of carbon targets in argon plasma at total pressure range (0.1-1.6 Pa). The carbon films aren’t composed of chemical impurities as measured by Auger electron spectroscopy (AES). The B field configurations affect to a greater extent on mechanical properties and don’t have weighty impact on deposition rates. For «mirror» B field, the films hardness (H) is a higher. The rise of Ar pressure results in a decrease H from 20 to 9 GPa. It is peculiar to a-C and ta-C films. The effect of B field configurations on elastic module (E) is shown in higher pressures.

Original languageEnglish
Title of host publicationAdvanced Materials Research
PublisherTrans Tech Publications Ltd
Pages721-725
Number of pages5
Volume1040
ISBN (Print)9783038352648
DOIs
Publication statusPublished - 2014
EventInternational Conference for Young Scientists “High Technology: Research and Applications 2014”, HTRA 2014 - Tomsk, Russian Federation
Duration: 26 Mar 201428 Mar 2014

Publication series

NameAdvanced Materials Research
Volume1040
ISSN (Print)10226680
ISSN (Electronic)16628985

Other

OtherInternational Conference for Young Scientists “High Technology: Research and Applications 2014”, HTRA 2014
CountryRussian Federation
CityTomsk
Period26.3.1428.3.14

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Keywords

  • Carbon based films
  • Dual magnetron
  • Sputtering

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yurjev, Y. N., Zaitcev, D. A., Sidelev, D. V., & Tupikova, O. S. (2014). Effect of magnetic field configuration of dual magnetron on carbon based films properties. In Advanced Materials Research (Vol. 1040, pp. 721-725). (Advanced Materials Research; Vol. 1040). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/AMR.1040.721