Effect of boric acid on thermal behavior of copper nanopowder/epoxy composites

Olga B. Nazarenko, Alexander I. Sechin, Tatyana V. Melnikova, P. M. Visakh

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The epoxy composites were synthesized from epoxy resin ED-20, polyethylene polyamine as curing agent and copper nanopowder and boric acid as fillers. The copper nanopowder was produced by electrical explosion of wires. The thermal properties of the epoxy composites at the heating in the atmosphere of air and argon from ambient temperature to 900 °C were characterized using thermogravimetric analysis and differential scanning calorimetry. The results showed that copper nanopowders catalyzed thermal oxidative degradation of the epoxy composites. The effect of the addition of boric acid in the epoxy polymer filled with copper nanopowder on the thermal stability of the composite at the heating in air was studied. It was found that the boric acid addition inhibited the degradation process. The limiting oxygen index was calculated in accordance with Van Krevelen and Hoftyzer equation.

Original languageEnglish
Pages (from-to)1-6
Number of pages6
JournalJournal of Thermal Analysis and Calorimetry
Volume131
Issue number1
DOIs
Publication statusAccepted/In press - 15 Nov 2017

Fingerprint

boric acids
Copper
copper
composite materials
Composite materials
Epoxy Resins
Filled polymers
Heating
Degradation
heating
Argon
thermal degradation
air
epoxy resins
Air
curing
fillers
ambient temperature
Explosions
Curing

Keywords

  • Composites
  • Copper nanopowder
  • Epoxy resin
  • Filler
  • Thermal stability

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry

Cite this

Effect of boric acid on thermal behavior of copper nanopowder/epoxy composites. / Nazarenko, Olga B.; Sechin, Alexander I.; Melnikova, Tatyana V.; Visakh, P. M.

In: Journal of Thermal Analysis and Calorimetry, Vol. 131, No. 1, 15.11.2017, p. 1-6.

Research output: Contribution to journalArticle

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AU - Visakh, P. M.

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