Distributed low-density lattice codes

Bin Chen, Dushantha N K Jayakody, Mark F. Flanagan

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This letter presents a novel distributed LDLC (D-LDLC) relaying scheme for the classical relay channel. The relay node decodes LDLC packets from the source and forwards an additional parity message to the destination. The destination then performs joint decoding in order to exploit the available coding gain as well as diversity gain. First, assuming AWGN links, density evolution is used to optimize the noise threshold of the overall parity-check matrix, and this method is shown to produce good finite-length D-LDLC designs. Then, we provide results for the optimized D-LDLCs under Rayleigh fading channel conditions. Joint decoding based on D-LDLC is shown to provide approximately 3 dB gain over distributed 4-PAM turbo codes under the same conditions (data rate and overall transmission power).

Original languageEnglish
Article number7317728
Pages (from-to)77-80
Number of pages4
JournalIEEE Communications Letters
Volume20
Issue number1
DOIs
Publication statusPublished - 1 Jan 2016
Externally publishedYes

Fingerprint

Decoding
Pulse amplitude modulation
Turbo codes
Rayleigh fading
Power transmission
Fading channels
Parity
Turbo Codes
Coding Gain
Relay Channel
Diversity Gain
Rayleigh Fading Channel
Decode
Relay
Optimise
Vertex of a graph

Keywords

  • Coded cooperation
  • Distributed channel coding
  • Low-density lattice codes (LDLCs)
  • Relay channel

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Modelling and Simulation

Cite this

Distributed low-density lattice codes. / Chen, Bin; Jayakody, Dushantha N K; Flanagan, Mark F.

In: IEEE Communications Letters, Vol. 20, No. 1, 7317728, 01.01.2016, p. 77-80.

Research output: Contribution to journalArticle

Chen, Bin ; Jayakody, Dushantha N K ; Flanagan, Mark F. / Distributed low-density lattice codes. In: IEEE Communications Letters. 2016 ; Vol. 20, No. 1. pp. 77-80.
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