Dissipation of solitary waves in aluminum with grain boundary

S. G. Psakhie, K. P. Zolnikov, D. Yu Saraev

    Research output: Contribution to journal › Article

    Abstract

    The behavior of passing solitary waves through the region of grain boundary has been investigated on the basis of the molecular dynamics method. It has been shown that solitary waves initiated by compression and shear loading have a different interaction with the grain boundary region. The possibilities of using solitary waves for nondestructive testing of materials, in particular, for testing the quality of coatings, for testing of accumulation of microdamages, etc. have been noted.

    Original languageEnglish
    Pages (from-to)475-477
    Number of pages3
    JournalShiyou Huagong/Petrochemical Technology
    Volume27
    Issue number10
    Publication statusPublished - 1998

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    Solitons
    Aluminum
    Grain boundaries
    Testing
    Nondestructive examination
    Molecular dynamics
    Coatings

    ASJC Scopus subject areas

    • Fuel Technology

    Cite this

    Psakhie, S. G., Zolnikov, K. P., & Saraev, D. Y. (1998). Dissipation of solitary waves in aluminum with grain boundary. Shiyou Huagong/Petrochemical Technology, 27(10), 475-477.

    Dissipation of solitary waves in aluminum with grain boundary. / Psakhie, S. G.; Zolnikov, K. P.; Saraev, D. Yu.

    In: Shiyou Huagong/Petrochemical Technology, Vol. 27, No. 10, 1998, p. 475-477.

    Research output: Contribution to journal › Article

    Psakhie, SG, Zolnikov, KP & Saraev, DY 1998, 'Dissipation of solitary waves in aluminum with grain boundary', Shiyou Huagong/Petrochemical Technology, vol. 27, no. 10, pp. 475-477.
    Psakhie SG, Zolnikov KP, Saraev DY. Dissipation of solitary waves in aluminum with grain boundary. Shiyou Huagong/Petrochemical Technology. 1998;27(10):475-477.
    Psakhie, S. G. ; Zolnikov, K. P. ; Saraev, D. Yu. / Dissipation of solitary waves in aluminum with grain boundary. In: Shiyou Huagong/Petrochemical Technology. 1998 ; Vol. 27, No. 10. pp. 475-477.
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