Abstract
Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements.
Original language | English |
---|---|
Pages (from-to) | 372-374 |
Number of pages | 3 |
Journal | The Soviet journal of nondestructive testing |
Volume | 19 |
Issue number | 5 |
Publication status | Published - May 1983 |
ASJC Scopus subject areas
- Engineering(all)