DETECTION OF DIFFUSION WELDING DEFECTS BY THERMAL NDT OF RECTIFIER ELEMENTS.

L. A. Bragina, V. P. Vavilov, A. I. Ivanov, O. M. Korol'kov, G. N. Surzhenkov, E. D. Khutoryanskii

Center for Industrial Tomography

Research output: Contribution to journal › Article

Abstract

Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements.

Original language	English
Pages (from-to)	372-374
Number of pages	3
Journal	The Soviet journal of nondestructive testing
Volume	19
Issue number	5
Publication status	Published - May 1983

ASJC Scopus subject areas

Engineering(all)

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Bragina, L. A., Vavilov, V. P., Ivanov, A. I., Korol'kov, O. M., Surzhenkov, G. N., & Khutoryanskii, E. D. (1983). DETECTION OF DIFFUSION WELDING DEFECTS BY THERMAL NDT OF RECTIFIER ELEMENTS. The Soviet journal of nondestructive testing, 19(5), 372-374.

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title = "DETECTION OF DIFFUSION WELDING DEFECTS BY THERMAL NDT OF RECTIFIER ELEMENTS.",

abstract = "Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements.",

author = "Bragina, {L. A.} and Vavilov, {V. P.} and Ivanov, {A. I.} and Korol'kov, {O. M.} and Surzhenkov, {G. N.} and Khutoryanskii, {E. D.}",

year = "1983",

month = may,

language = "English",

volume = "19",

pages = "372--374",

journal = "Soviet Journal of Nondestructive Testing",

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publisher = "Consultants Bureau",

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T1 - DETECTION OF DIFFUSION WELDING DEFECTS BY THERMAL NDT OF RECTIFIER ELEMENTS.

AU - Bragina, L. A.

AU - Vavilov, V. P.

AU - Ivanov, A. I.

AU - Korol'kov, O. M.

AU - Surzhenkov, G. N.

AU - Khutoryanskii, E. D.

PY - 1983/5

Y1 - 1983/5

N2 - Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements.

AB - Problems of flaw detection in contact joints in rectifier elements (RE) of semiconductor devices are considered investigating the possibility of applying thermal nondestructive testing to such elements.

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VL - 19

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EP - 374

JO - Soviet Journal of Nondestructive Testing

JF - Soviet Journal of Nondestructive Testing

SN - 0038-5492

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