Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters

S. V. Kim, V. Ya Ushakov

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.

Original languageEnglish
Pages (from-to)729-735
Number of pages7
JournalRussian Physics Journal
Volume59
Issue number5
DOIs
Publication statusPublished - 1 Sep 2016

Keywords

  • compound filler
  • compound properties
  • thermal aging of a compound

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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