Abstract
The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.
| Original language | English |
|---|---|
| Pages (from-to) | 729-735 |
| Number of pages | 7 |
| Journal | Russian Physics Journal |
| Volume | 59 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1 Sep 2016 |
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Keywords
- compound filler
- compound properties
- thermal aging of a compound
ASJC Scopus subject areas
- Physics and Astronomy(all)
Cite this
Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters. / Kim, S. V.; Ushakov, V. Ya.
In: Russian Physics Journal, Vol. 59, No. 5, 01.09.2016, p. 729-735.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters
AU - Kim, S. V.
AU - Ushakov, V. Ya
PY - 2016/9/1
Y1 - 2016/9/1
N2 - The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.
AB - The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.
KW - compound filler
KW - compound properties
KW - thermal aging of a compound
UR - http://www.scopus.com/inward/record.url?scp=85014424318&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85014424318&partnerID=8YFLogxK
U2 - 10.1007/s11182-016-0828-2
DO - 10.1007/s11182-016-0828-2
M3 - Article
VL - 59
SP - 729
EP - 735
JO - Russian Physics Journal
JF - Russian Physics Journal
SN - 1064-8887
IS - 5
ER -