Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters

Abstract

The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.

Original language	English
Pages (from-to)	729-735
Number of pages	7
Journal	Russian Physics Journal
Volume	59
Issue number	5
DOIs	https://doi.org/10.1007/s11182-016-0828-2
Publication status	Published - 1 Sep 2016

Keywords

compound filler
compound properties
thermal aging of a compound

ASJC Scopus subject areas

Physics and Astronomy(all)

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10.1007/s11182-016-0828-2

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title = "Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters",

abstract = "The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.",

keywords = "compound filler, compound properties, thermal aging of a compound",

author = "Kim, {S. V.} and Ushakov, {V. Ya}",

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N2 - The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.

AB - The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.

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KW - compound properties

KW - thermal aging of a compound

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