Crawling spot thermal nondestructive testing (NDT) for plaster inspection and comparison with dynamic thermography with extended heating

Paolo G. Bison, Alberto Braggiotti, Chiara Bressan, Ermanno G. Grinzato, S. Marinetti, Andrea Mazzoldi, Vladimir Vavilov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Defects in building materials located parallel to the front surface, like plaster detachment, or perpendicularly, such as cracks, are detected creating a space-varying heat flux. A variant of the `flying spot' technique called `crawling spot' was developed in order to fit requirements of these materials. This nondestructive method is performed with a localized radiant heating of the surface and synchronized local temperature measurement in the IR band. The identification of delaminations and cracks was theoretically and experimentally studied using two different procedures. Results obtained for plaster detachments were compared with dynamic thermography, applied with an extended excitation of the surface and analysis of the normalized thermal contrast both in amplitude and time. Another technique requires a continuously moving spot to heat the surface while a sequence of thermograms is recorded. The temperature profile of each pixel has to be reconstructed according to the spot speed and trajectory. This procedure was applied to stone crack detection. The experimental apparatus is thoroughly described.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsSharon A. Semanovich
Pages53-63
Number of pages11
Volume2473
Publication statusPublished - 1995
EventThermosense XVII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications - Orlando, FL, USA
Duration: 19 Apr 199521 Apr 1995

Other

OtherThermosense XVII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications
CityOrlando, FL, USA
Period19.4.9521.4.95

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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