Abstract
The recent development of microelectronics is closely linked to the problem of thermal regulation. The levels of heat generation in high-speed computer chips are now approaching very high values and they are on the edge of exceeding the capabilities of today's air-cooling techniques. Thin liquid films may provide very high heat transfer intensity and may be used for cooling of microelectronics. A particularly promising technological solution is a set-up where heat is transferred to a very thin liquid film driven by a forced gas or vapor flow in a micro-channel. However, development such a cooling system requires significant advances in fundamental research, since the stability of joint flow of liquid film and gas is rather complex problem. Flow patterns, heat transfer laws and film rupture mechanisms for shear-driven locally heated liquid film flows remain only partially understood. The paper focuses upon shear-driven liquid film evaporative cooling of high-speed computer chips. The recent progress that has been achieved through conducting theoretical and numerical modeling as well as new experimental data has been discussed.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006 |
| Pages | 1265-1278 |
| Number of pages | 14 |
| Volume | 2006 B |
| Publication status | Published - 2006 |
| Event | 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006 - Limerick, Ireland Duration: 19 Jun 2006 → 21 Jun 2006 |
Other
| Other | 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006 |
|---|---|
| Country | Ireland |
| City | Limerick |
| Period | 19.6.06 → 21.6.06 |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Cooling of microelectronics by shear-driven liquid films. / Kabov, Oieg.
Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006. Vol. 2006 B 2006. p. 1265-1278.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Cooling of microelectronics by shear-driven liquid films
AU - Kabov, Oieg
PY - 2006
Y1 - 2006
N2 - The recent development of microelectronics is closely linked to the problem of thermal regulation. The levels of heat generation in high-speed computer chips are now approaching very high values and they are on the edge of exceeding the capabilities of today's air-cooling techniques. Thin liquid films may provide very high heat transfer intensity and may be used for cooling of microelectronics. A particularly promising technological solution is a set-up where heat is transferred to a very thin liquid film driven by a forced gas or vapor flow in a micro-channel. However, development such a cooling system requires significant advances in fundamental research, since the stability of joint flow of liquid film and gas is rather complex problem. Flow patterns, heat transfer laws and film rupture mechanisms for shear-driven locally heated liquid film flows remain only partially understood. The paper focuses upon shear-driven liquid film evaporative cooling of high-speed computer chips. The recent progress that has been achieved through conducting theoretical and numerical modeling as well as new experimental data has been discussed.
AB - The recent development of microelectronics is closely linked to the problem of thermal regulation. The levels of heat generation in high-speed computer chips are now approaching very high values and they are on the edge of exceeding the capabilities of today's air-cooling techniques. Thin liquid films may provide very high heat transfer intensity and may be used for cooling of microelectronics. A particularly promising technological solution is a set-up where heat is transferred to a very thin liquid film driven by a forced gas or vapor flow in a micro-channel. However, development such a cooling system requires significant advances in fundamental research, since the stability of joint flow of liquid film and gas is rather complex problem. Flow patterns, heat transfer laws and film rupture mechanisms for shear-driven locally heated liquid film flows remain only partially understood. The paper focuses upon shear-driven liquid film evaporative cooling of high-speed computer chips. The recent progress that has been achieved through conducting theoretical and numerical modeling as well as new experimental data has been discussed.
UR - http://www.scopus.com/inward/record.url?scp=33846956132&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33846956132&partnerID=8YFLogxK
M3 - Conference contribution
SN - 0791847608
SN - 9780791847602
VL - 2006 B
SP - 1265
EP - 1278
BT - Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
ER -