Abstract
Abstract: A mathematical model is proposed for determining the quality of applying a heat-conducting compound, and simulation results are presented. The model is based on the theory of heat transfer in a solid. The model has been verified using experimental data obtained by measuring the temperature at the points of contact of two bodies using thermocouples. It is shown that the data obtained using thermocouples coincide with the data obtained using thermopower.
Original language | English |
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Pages (from-to) | 284-290 |
Number of pages | 7 |
Journal | Russian Journal of Nondestructive Testing |
Volume | 56 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1 Mar 2020 |
Keywords
- heat transfer
- Seebeck effect
- thermal interface
- thermal resistance
- thermopower
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering