Control of Quality of Applying Heat-Conducting Compound

A. A. Soldatov, A. A. Dement’ev, A. I. Soldatov, I. M. Vasil’ev

Research output: Contribution to journalArticlepeer-review

Abstract

Abstract: A mathematical model is proposed for determining the quality of applying a heat-conducting compound, and simulation results are presented. The model is based on the theory of heat transfer in a solid. The model has been verified using experimental data obtained by measuring the temperature at the points of contact of two bodies using thermocouples. It is shown that the data obtained using thermocouples coincide with the data obtained using thermopower.

Original languageEnglish
Pages (from-to)284-290
Number of pages7
JournalRussian Journal of Nondestructive Testing
Volume56
Issue number3
DOIs
Publication statusPublished - 1 Mar 2020

Keywords

  • heat transfer
  • Seebeck effect
  • thermal interface
  • thermal resistance
  • thermopower

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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