Contamination of magnetron sputtered metallic films by oxygen from residual atmosphere in deposition chamber

Petr Pokorný, Jindřich Musil, Přemysl Fitl, Michal Novotný, Jan Lančok, Jiří Bulíř

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

The article reports on the contamination of Ag thin films sputtered from a pure Ag target in Ar and Ne gas by the RF magnetron by gas atoms contained in residual gas atmosphere in the deposition chamber at different values of the base pressure. The amount of O atoms generated at different values of base pressure is compared with the amount of Ag atoms sputtered at different deposition rates of Ag film. This comparison reveals a great problem in the formation of pure metallic films at low deposition rates and high values of the base pressure. No pure Ag films can be deposited at low in deposition chambers evacuated with diffusion or root pumps to the base pressures lower than 1mPa only.

Original languageEnglish
Pages (from-to)416-421
Number of pages6
JournalPlasma Processes and Polymers
Volume12
Issue number5
DOIs
Publication statusPublished - 1 May 2015

Fingerprint

base pressure
Metallic films
contamination
Contamination
chambers
Oxygen
atmospheres
Gases
oxygen
Deposition rates
Atoms
diffusion pumps
atoms
residual gas
gases
Pumps
pumps
Thin films
thin films

Keywords

  • Contamination
  • Low-pressure discharges
  • Magnetron
  • Metallic films
  • Sputtering

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Polymers and Plastics

Cite this

Contamination of magnetron sputtered metallic films by oxygen from residual atmosphere in deposition chamber. / Pokorný, Petr; Musil, Jindřich; Fitl, Přemysl; Novotný, Michal; Lančok, Jan; Bulíř, Jiří.

In: Plasma Processes and Polymers, Vol. 12, No. 5, 01.05.2015, p. 416-421.

Research output: Contribution to journalArticle

Pokorný, Petr ; Musil, Jindřich ; Fitl, Přemysl ; Novotný, Michal ; Lančok, Jan ; Bulíř, Jiří. / Contamination of magnetron sputtered metallic films by oxygen from residual atmosphere in deposition chamber. In: Plasma Processes and Polymers. 2015 ; Vol. 12, No. 5. pp. 416-421.
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