Imagerie électromagnétique sans contact de composants électroniques de puissance à semi-conducteurs: Application à la caractérisation du vieillissement des métallisations de surface

Translated title of the contribution: Contactless electromagnetic imaging of power electronic semiconductor devices. Application to the characterization of surface metalizations ageing

Tien Anh Nguyen, Stéphane Lefebvre, Pierre Yves Joubert

Research output: Contribution to journalArticle

Abstract

The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.

Translated title of the contributionContactless electromagnetic imaging of power electronic semiconductor devices. Application to the characterization of surface metalizations ageing
Original languageFrench
Pages (from-to)65-89
Number of pages25
JournalInstrumentation Mesure Metrologie
Volume12
Issue number1-2
DOIs
Publication statusPublished - 1 Dec 2012
Externally publishedYes

Keywords

  • Ageing
  • Characterization
  • Eddy current sensors
  • Hall effet Sensor
  • Inverse problem
  • Metallization
  • Semiconductor power module
  • Surface current distribution

ASJC Scopus subject areas

  • Instrumentation
  • Engineering (miscellaneous)

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