Imagerie électromagnétique sans contact de composants électroniques de puissance à semi-conducteurs: Application à la caractérisation du vieillissement des métallisations de surface

Translated title of the contribution: Contactless electromagnetic imaging of power electronic semiconductor devices. Application to the characterization of surface metalizations ageing

Tien Anh Nguyen, Stéphane Lefebvre, Pierre Yves Joubert

Research output: Contribution to journalArticle

Abstract

The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.

Original languageFrench
Pages (from-to)65-89
Number of pages25
JournalInstrumentation Mesure Metrologie
Volume12
Issue number1-2
DOIs
Publication statusPublished - 1 Dec 2012
Externally publishedYes

Fingerprint

Semiconductor devices
Power electronics
semiconductor devices
Aging of materials
electromagnetism
Imaging techniques
Metallizing
electronics
Semiconductor materials
causes
Magnetic flux
Eddy currents
eddy currents
magnetic flux
flux density
chips
inversions
Monitoring

Keywords

  • Ageing
  • Characterization
  • Eddy current sensors
  • Hall effet Sensor
  • Inverse problem
  • Metallization
  • Semiconductor power module
  • Surface current distribution

ASJC Scopus subject areas

  • Instrumentation
  • Engineering (miscellaneous)

Cite this

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AU - Lefebvre, Stéphane

AU - Joubert, Pierre Yves

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AB - The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.

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KW - Surface current distribution

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