Abstract
The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.
| Translated title of the contribution | Contactless electromagnetic imaging of power electronic semiconductor devices. Application to the characterization of surface metalizations ageing |
|---|---|
| Original language | French |
| Pages (from-to) | 65-89 |
| Number of pages | 25 |
| Journal | Instrumentation Mesure Metrologie |
| Volume | 12 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 1 Dec 2012 |
| Externally published | Yes |
Keywords
- Ageing
- Characterization
- Eddy current sensors
- Hall effet Sensor
- Inverse problem
- Metallization
- Semiconductor power module
- Surface current distribution
ASJC Scopus subject areas
- Instrumentation
- Engineering (miscellaneous)
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Nguyen, T. A., Lefebvre, S., & Joubert, P. Y. (2012). Imagerie électromagnétique sans contact de composants électroniques de puissance à semi-conducteurs: Application à la caractérisation du vieillissement des métallisations de surface. Instrumentation Mesure Metrologie, 12(1-2), 65-89. https://doi.org/10.3166/I2M.12.1-2.65-89