Abstract
The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.
| Original language | French |
|---|---|
| Pages (from-to) | 65-89 |
| Number of pages | 25 |
| Journal | Instrumentation Mesure Metrologie |
| Volume | 12 |
| Issue number | 1-2 |
| DOIs | |
| Publication status | Published - 1 Dec 2012 |
| Externally published | Yes |
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Keywords
- Ageing
- Characterization
- Eddy current sensors
- Hall effet Sensor
- Inverse problem
- Metallization
- Semiconductor power module
- Surface current distribution
ASJC Scopus subject areas
- Instrumentation
- Engineering (miscellaneous)
Cite this
Imagerie électromagnétique sans contact de composants électroniques de puissance à semi-conducteurs : Application à la caractérisation du vieillissement des métallisations de surface. / Nguyen, Tien Anh; Lefebvre, Stéphane; Joubert, Pierre Yves.
In: Instrumentation Mesure Metrologie, Vol. 12, No. 1-2, 01.12.2012, p. 65-89.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Imagerie électromagnétique sans contact de composants électroniques de puissance à semi-conducteurs
T2 - Application à la caractérisation du vieillissement des métallisations de surface
AU - Nguyen, Tien Anh
AU - Lefebvre, Stéphane
AU - Joubert, Pierre Yves
PY - 2012/12/1
Y1 - 2012/12/1
N2 - The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.
AB - The ageing of the metallization layer of power semiconductor dies can be a cause of failure. Indeed, this ageing is likely to modify the distribution of the currents flowing within the chip, and cause hot spots. In this study, we evaluate this ageing by two noncontact electromagnetic techniques: the eddy current technique and the inversion of a magnetic flux density cartography. Experimental results show that these methods are promising for the monitoring of the ageing of power semiconductor die metallization.
KW - Ageing
KW - Characterization
KW - Eddy current sensors
KW - Hall effet Sensor
KW - Inverse problem
KW - Metallization
KW - Semiconductor power module
KW - Surface current distribution
UR - http://www.scopus.com/inward/record.url?scp=84875354735&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84875354735&partnerID=8YFLogxK
U2 - 10.3166/I2M.12.1-2.65-89
DO - 10.3166/I2M.12.1-2.65-89
M3 - Статья
AN - SCOPUS:84875354735
VL - 12
SP - 65
EP - 89
JO - Instrumentation Mesure Metrologie
JF - Instrumentation Mesure Metrologie
SN - 1631-4670
IS - 1-2
ER -