Conductive TiC/Ti-Cu/C composites fabricated by Ti-Cu alloy reactive infiltration into 3D-printed carbon performs

Carlos R. Rambo, Nahum Travitzky, Peter Greil

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

The microstructure and electrical properties of dense TiC/Ti-Cu/C composites fabricated by pressureless reactive infiltration of Ti-Cu alloy into porous starch-derived carbon preforms prepared by 3D printing was evaluated. Porosities in the range of 65-78vol% were varied by post-isostatic pressing the as-printed preforms at pressures of 50-400MPa. The reactive melt infiltration was carried out at 1100°C in a flowing Ar atmosphere and resulted in formation of a composite comprised predominantly of substoichiometric TiC, binary intermetallic Ti-Cu phases and residual carbon. Scanning electron microscopy analyses revealed a microstructure consisting of dispersed fine-grained TiC in a Ti-Cu matrix surrounded by a continuous carbon phase. Electrical resistivity measurements using the four-probe method were carried out and correlated to the composite microstructure. The electrical resistivity was evaluated in terms of carbon and TiC volume fractions.

Original languageEnglish
Pages (from-to)1971-1976
Number of pages6
JournalJournal of Composite Materials
Volume49
Issue number16
DOIs
Publication statusPublished - 3 Jul 2015

Keywords

  • 3D printing
  • reactive infiltration
  • Ti-Cu alloy
  • TiC/Ti-Cu/C composites

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry

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