Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

M. Bouarroudj, Z. Khatir, J. P. Ousten, L. Dupont, S. Lefebvre, F. Badel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Original languageEnglish
Title of host publication2007 European Conference on Power Electronics and Applications, EPE
DOIs
Publication statusPublished - 1 Dec 2007
Externally publishedYes
Event2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Denmark
Duration: 2 Sep 20075 Sep 2007

Publication series

Name2007 European Conference on Power Electronics and Applications, EPE

Conference

Conference2007 European Conference on Power Electronics and Applications, EPE
CountryDenmark
CityAalborg
Period2.9.075.9.07

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Keywords

  • Automotive application
  • High temperature electronics
  • Hybrid power integration
  • IGBT
  • Packaging
  • Power cycling
  • Power electronic modules
  • Thermal cycling

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Bouarroudj, M., Khatir, Z., Ousten, J. P., Dupont, L., Lefebvre, S., & Badel, F. (2007). Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. In 2007 European Conference on Power Electronics and Applications, EPE [4417457] (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457