TY - GEN
T1 - Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
AU - Bouarroudj, M.
AU - Khatir, Z.
AU - Ousten, J. P.
AU - Dupont, L.
AU - Lefebvre, S.
AU - Badel, F.
PY - 2007/12/1
Y1 - 2007/12/1
N2 - The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.
AB - The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.
KW - Automotive application
KW - High temperature electronics
KW - Hybrid power integration
KW - IGBT
KW - Packaging
KW - Power cycling
KW - Power electronic modules
KW - Thermal cycling
UR - http://www.scopus.com/inward/record.url?scp=51049101257&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51049101257&partnerID=8YFLogxK
U2 - 10.1109/EPE.2007.4417457
DO - 10.1109/EPE.2007.4417457
M3 - Conference contribution
AN - SCOPUS:51049101257
SN - 9075815115
SN - 9789075815115
T3 - 2007 European Conference on Power Electronics and Applications, EPE
BT - 2007 European Conference on Power Electronics and Applications, EPE
T2 - 2007 European Conference on Power Electronics and Applications, EPE
Y2 - 2 September 2007 through 5 September 2007
ER -