Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Abstract

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Original language	English
Title of host publication	2007 European Conference on Power Electronics and Applications, EPE
DOIs	https://doi.org/10.1109/EPE.2007.4417457
Publication status	Published - 1 Dec 2007
Externally published	Yes
Event	2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Denmark Duration: 2 Sep 2007 → 5 Sep 2007

Publication series

Name	2007 European Conference on Power Electronics and Applications, EPE

Conference

Conference	2007 European Conference on Power Electronics and Applications, EPE
Country	Denmark
City	Aalborg
Period	2.9.07 → 5.9.07

Keywords

Automotive application
High temperature electronics
Hybrid power integration
IGBT
Packaging
Power cycling
Power electronic modules
Thermal cycling

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering

Access to Document

10.1109/EPE.2007.4417457

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Cite this

Bouarroudj, M., Khatir, Z., Ousten, J. P., Dupont, L., Lefebvre, S., & Badel, F. (2007). Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. In 2007 European Conference on Power Electronics and Applications, EPE [4417457] (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. / Bouarroudj, M.; Khatir, Z.; Ousten, J. P.; Dupont, L.; Lefebvre, S.; Badel, F.

2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417457 (2007 European Conference on Power Electronics and Applications, EPE).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Bouarroudj, M, Khatir, Z, Ousten, JP, Dupont, L, Lefebvre, S & Badel, F 2007, Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. in 2007 European Conference on Power Electronics and Applications, EPE., 4417457, 2007 European Conference on Power Electronics and Applications, EPE, 2007 European Conference on Power Electronics and Applications, EPE, Aalborg, Denmark, 2.9.07. https://doi.org/10.1109/EPE.2007.4417457

Bouarroudj M, Khatir Z, Ousten JP, Dupont L, Lefebvre S, Badel F. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. In 2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417457. (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457

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abstract = "The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.",

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AU - Lefebvre, S.

AU - Badel, F.

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KW - High temperature electronics

KW - Hybrid power integration

KW - IGBT

KW - Packaging

KW - Power cycling

KW - Power electronic modules

KW - Thermal cycling

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