Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

M. Bouarroudj, Z. Khatir, J. P. Ousten, L. Dupont, S. Lefebvre, F. Badel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

11 Citations (Scopus)

Abstract

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Original languageEnglish
Title of host publication2007 European Conference on Power Electronics and Applications, EPE
DOIs
Publication statusPublished - 1 Dec 2007
Externally publishedYes
Event2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Denmark
Duration: 2 Sep 2007 → 5 Sep 2007

Publication series

Name2007 European Conference on Power Electronics and Applications, EPE

Conference

Conference2007 European Conference on Power Electronics and Applications, EPE
CountryDenmark
CityAalborg
Period2.9.07 → 5.9.07

Fingerprint

Insulated gate bipolar transistors (IGBT)
Thermal cycling
Failure modes
Stress concentration

Keywords

  • Automotive application
  • High temperature electronics
  • Hybrid power integration
  • IGBT
  • Packaging
  • Power cycling
  • Power electronic modules
  • Thermal cycling

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Bouarroudj, M., Khatir, Z., Ousten, J. P., Dupont, L., Lefebvre, S., & Badel, F. (2007). Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. In 2007 European Conference on Power Electronics and Applications, EPE [4417457] (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. / Bouarroudj, M.; Khatir, Z.; Ousten, J. P.; Dupont, L.; Lefebvre, S.; Badel, F.

2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417457 (2007 European Conference on Power Electronics and Applications, EPE).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Bouarroudj, M, Khatir, Z, Ousten, JP, Dupont, L, Lefebvre, S & Badel, F 2007, Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. in 2007 European Conference on Power Electronics and Applications, EPE., 4417457, 2007 European Conference on Power Electronics and Applications, EPE, 2007 European Conference on Power Electronics and Applications, EPE, Aalborg, Denmark, 2.9.07. https://doi.org/10.1109/EPE.2007.4417457
Bouarroudj M, Khatir Z, Ousten JP, Dupont L, Lefebvre S, Badel F. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. In 2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417457. (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417457
Bouarroudj, M. ; Khatir, Z. ; Ousten, J. P. ; Dupont, L. ; Lefebvre, S. ; Badel, F. / Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules. 2007 European Conference on Power Electronics and Applications, EPE. 2007. (2007 European Conference on Power Electronics and Applications, EPE).
@inproceedings{91ee11eb6c414d4581ba4abb662b7e17,
title = "Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules",
abstract = "The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.",
keywords = "Automotive application, High temperature electronics, Hybrid power integration, IGBT, Packaging, Power cycling, Power electronic modules, Thermal cycling",
author = "M. Bouarroudj and Z. Khatir and Ousten, {J. P.} and L. Dupont and S. Lefebvre and F. Badel",
year = "2007",
month = "12",
day = "1",
doi = "10.1109/EPE.2007.4417457",
language = "English",
isbn = "9075815115",
series = "2007 European Conference on Power Electronics and Applications, EPE",
booktitle = "2007 European Conference on Power Electronics and Applications, EPE",

}

TY - GEN

T1 - Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

AU - Bouarroudj, M.

AU - Khatir, Z.

AU - Ousten, J. P.

AU - Dupont, L.

AU - Lefebvre, S.

AU - Badel, F.

PY - 2007/12/1

Y1 - 2007/12/1

N2 - The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

AB - The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

KW - Automotive application

KW - High temperature electronics

KW - Hybrid power integration

KW - IGBT

KW - Packaging

KW - Power cycling

KW - Power electronic modules

KW - Thermal cycling

UR - http://www.scopus.com/inward/record.url?scp=51049101257&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=51049101257&partnerID=8YFLogxK

U2 - 10.1109/EPE.2007.4417457

DO - 10.1109/EPE.2007.4417457

M3 - Conference contribution

SN - 9075815115

SN - 9789075815115

T3 - 2007 European Conference on Power Electronics and Applications, EPE

BT - 2007 European Conference on Power Electronics and Applications, EPE

ER -

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