Characterization of high-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films

J. Vlcek, A. D. Pajdarova, P. Belsky, J. Lukas, P. Kudlacek, J. Musil

Research output: Contribution to journalConference article

4 Citations (Scopus)

Abstract

A systematic time-resolved plasma diagnostics was carried out in high-power pulsed dc magnetron discharges used for ionized high-rate sputtering of high-quality, highly conductive copper films. The deposition rate of Cu films formed on a grounded substrate at the distance of 100mm from the target was higher than 2μm/min (averaged over a total deposition time) for an average target power loading in a pulse Pda=700W/cm2 (calculated for a total area of the target) at a repetition frequency f = lkHz, a 20% duty cycle and argon pressures p=0.1 and 1 Pa. The flux of sputtered Cu atoms was highly ionized with a strong predominance of Cu+ ions (80-95% after a short initial stage of pulses) in total ion fluxes to the substrate.

Original languageEnglish
Pages (from-to)465-469
Number of pages5
JournalProceedings, Annual Technical Conference - Society of Vacuum Coaters
Publication statusPublished - 1 Dec 2005
EventSVC, Society of Vacuum Coaters - 48th Annual Technical Conference - Denver, CO, United States
Duration: 23 Apr 200528 Apr 2005

Fingerprint

Sputtering
Copper
sputtering
Ions
Fluxes
Plasma diagnostics
copper
Argon
Substrates
Deposition rates
plasma diagnostics
pulses
Atoms
repetition
ions
argon
cycles
atoms

Keywords

  • High-power pulsed magnetron
  • High-rate deposition
  • Ionized sputtering
  • Time-resolved diagnostics

ASJC Scopus subject areas

  • Mechanical Engineering
  • Surfaces and Interfaces
  • Fluid Flow and Transfer Processes
  • Surfaces, Coatings and Films

Cite this

Characterization of high-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films. / Vlcek, J.; Pajdarova, A. D.; Belsky, P.; Lukas, J.; Kudlacek, P.; Musil, J.

In: Proceedings, Annual Technical Conference - Society of Vacuum Coaters, 01.12.2005, p. 465-469.

Research output: Contribution to journalConference article

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AU - Vlcek, J.

AU - Pajdarova, A. D.

AU - Belsky, P.

AU - Lukas, J.

AU - Kudlacek, P.

AU - Musil, J.

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N2 - A systematic time-resolved plasma diagnostics was carried out in high-power pulsed dc magnetron discharges used for ionized high-rate sputtering of high-quality, highly conductive copper films. The deposition rate of Cu films formed on a grounded substrate at the distance of 100mm from the target was higher than 2μm/min (averaged over a total deposition time) for an average target power loading in a pulse Pda=700W/cm2 (calculated for a total area of the target) at a repetition frequency f = lkHz, a 20% duty cycle and argon pressures p=0.1 and 1 Pa. The flux of sputtered Cu atoms was highly ionized with a strong predominance of Cu+ ions (80-95% after a short initial stage of pulses) in total ion fluxes to the substrate.

AB - A systematic time-resolved plasma diagnostics was carried out in high-power pulsed dc magnetron discharges used for ionized high-rate sputtering of high-quality, highly conductive copper films. The deposition rate of Cu films formed on a grounded substrate at the distance of 100mm from the target was higher than 2μm/min (averaged over a total deposition time) for an average target power loading in a pulse Pda=700W/cm2 (calculated for a total area of the target) at a repetition frequency f = lkHz, a 20% duty cycle and argon pressures p=0.1 and 1 Pa. The flux of sputtered Cu atoms was highly ionized with a strong predominance of Cu+ ions (80-95% after a short initial stage of pulses) in total ion fluxes to the substrate.

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