Calculation of the temperature field of a printed-circuit board with account for convective and radiative heat exchange on the board surface

V. P. Alekseev, G. V. Kuznetsov, S. V. Shloma

Research output: Contribution to journalArticle

Abstract

The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ± 4°C.

Original languageEnglish
Pages (from-to)177-179
Number of pages3
JournalInzhenerno-Fizicheskii Zhurnal
Volume75
Issue number5
Publication statusPublished - 2002
Externally publishedYes

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Printed circuit boards
Temperature distribution
Numerical analysis
Hot Temperature

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Mechanical Engineering

Cite this

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abstract = "The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ± 4°C.",
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