The temperature field of a printed-circuit board has been simulated numerically according to the two-dimensional thermal model with account for convective and radiative heat exchange on the board surface. The temperature fields in the actual printed-circuit board have been determined experimentally. The deviation of the results of the numerical analysis from the experimental data does not exceed ± 4°C.
|Number of pages||3|
|Publication status||Published - 2002|
ASJC Scopus subject areas
- Chemical Engineering(all)
- Mechanical Engineering