Calculation of diffusion properties of grain boundaries in nanocrystalline copper

S. G. Psakhie, K. P. Zolnikov, D. S. Kryzhevich

Research output: Contribution to journalArticle

Abstract

We perform a molecular dynamics simulation of diffusion processes in the vicinity of the grain boundary. Calculations are carried out for the symmetric tilt boundary Σ = 5 at elevated temperatures. It is shown that in the vicinity of the grain boundary region high-temperature heating causes noticeable atomic displacements and thus governs active grain boundary diffusion. The calculation results demonstrate that the grain boundary diffusion parameters can be estimated with a rather high accuracy on the basis of molecular dynamics calculations. This gives an opportunity to study the atomic mechanisms of how temperature and external mechanical fields influence diffusion processes and structural rearrangement both in the vicinity of the grain boundary and within the grain bulk.

Original languageEnglish
Pages (from-to)25-28
Number of pages4
JournalPhysical Mesomechanics
Volume11
Issue number1-2
DOIs
Publication statusPublished - 2008

Fingerprint

Copper
Grain boundaries
grain boundaries
copper
Molecular dynamics
molecular dynamics
Temperature
Heating
heating
temperature
causes
Computer simulation
simulation

ASJC Scopus subject areas

  • Mechanics of Materials
  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Calculation of diffusion properties of grain boundaries in nanocrystalline copper. / Psakhie, S. G.; Zolnikov, K. P.; Kryzhevich, D. S.

In: Physical Mesomechanics, Vol. 11, No. 1-2, 2008, p. 25-28.

Research output: Contribution to journalArticle

Psakhie, S. G. ; Zolnikov, K. P. ; Kryzhevich, D. S. / Calculation of diffusion properties of grain boundaries in nanocrystalline copper. In: Physical Mesomechanics. 2008 ; Vol. 11, No. 1-2. pp. 25-28.
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