Application of a Tangential Magnetic Field and Negative Repetitively Pulsed Bias for Suppression of Vacuum-Arc Copper Macroparticles

Research output: Contribution to journalArticle

Abstract

The joint effect of magnetic fields normal and tangential to the cathode surface and of short-pulse highfrequency bias potential of negative polarity on the accumulation of macroparticles on the potential target immersed in copper vacuum-arc plasma is studied. It is shown that the application of a vacuum-arc evaporator with the magnetic field tangential to the cathode surface reduces by 5 times generation of copper macroparticles in comparison with an axially symmetric vacuum-arc evaporator in which the magnetic field normal to the working cathode surface is used. It is established that the joint action of the tangential field and short-pulse high-frequency bias potential makes it possible to decrease by 2–3 orders of magnitude the density of copper macroparticles on the target surface.

Original languageEnglish
Pages (from-to)1-7
Number of pages7
JournalRussian Physics Journal
DOIs
Publication statusAccepted/In press - 20 Oct 2016

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arcs
retarding
copper
vacuum
evaporators
cathodes
magnetic fields
pulses
plasma jets
polarity

Keywords

  • high-frequency short-pulse negative bias potential
  • metal plasma
  • microdrop fraction
  • vacuum-arc discharge

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

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title = "Application of a Tangential Magnetic Field and Negative Repetitively Pulsed Bias for Suppression of Vacuum-Arc Copper Macroparticles",
abstract = "The joint effect of magnetic fields normal and tangential to the cathode surface and of short-pulse highfrequency bias potential of negative polarity on the accumulation of macroparticles on the potential target immersed in copper vacuum-arc plasma is studied. It is shown that the application of a vacuum-arc evaporator with the magnetic field tangential to the cathode surface reduces by 5 times generation of copper macroparticles in comparison with an axially symmetric vacuum-arc evaporator in which the magnetic field normal to the working cathode surface is used. It is established that the joint action of the tangential field and short-pulse high-frequency bias potential makes it possible to decrease by 2–3 orders of magnitude the density of copper macroparticles on the target surface.",
keywords = "high-frequency short-pulse negative bias potential, metal plasma, microdrop fraction, vacuum-arc discharge",
author = "Ryabchikov, {A. I.} and Peter Semenovich Anan'in and Shevelev, {A. E.}",
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AU - Ryabchikov, A. I.

AU - Anan'in, Peter Semenovich

AU - Shevelev, A. E.

PY - 2016/10/20

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N2 - The joint effect of magnetic fields normal and tangential to the cathode surface and of short-pulse highfrequency bias potential of negative polarity on the accumulation of macroparticles on the potential target immersed in copper vacuum-arc plasma is studied. It is shown that the application of a vacuum-arc evaporator with the magnetic field tangential to the cathode surface reduces by 5 times generation of copper macroparticles in comparison with an axially symmetric vacuum-arc evaporator in which the magnetic field normal to the working cathode surface is used. It is established that the joint action of the tangential field and short-pulse high-frequency bias potential makes it possible to decrease by 2–3 orders of magnitude the density of copper macroparticles on the target surface.

AB - The joint effect of magnetic fields normal and tangential to the cathode surface and of short-pulse highfrequency bias potential of negative polarity on the accumulation of macroparticles on the potential target immersed in copper vacuum-arc plasma is studied. It is shown that the application of a vacuum-arc evaporator with the magnetic field tangential to the cathode surface reduces by 5 times generation of copper macroparticles in comparison with an axially symmetric vacuum-arc evaporator in which the magnetic field normal to the working cathode surface is used. It is established that the joint action of the tangential field and short-pulse high-frequency bias potential makes it possible to decrease by 2–3 orders of magnitude the density of copper macroparticles on the target surface.

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