Abstract
This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.
| Original language | English |
|---|---|
| Pages (from-to) | 418-420 |
| Number of pages | 3 |
| Journal | Vacuum |
| Volume | 160 |
| DOIs | |
| Publication status | Published - 1 Feb 2019 |
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Keywords
- Angular distribution
- Hot target
- Magnetron sputtering
- Ni film
- Target utilization
ASJC Scopus subject areas
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
Cite this
Angular thickness distribution and target utilization for hot Ni target magnetron sputtering. / Sidelev, Dmitrii V.; Krivobokov, Valery P.
In: Vacuum, Vol. 160, 01.02.2019, p. 418-420.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Angular thickness distribution and target utilization for hot Ni target magnetron sputtering
AU - Sidelev, Dmitrii V.
AU - Krivobokov, Valery P.
PY - 2019/2/1
Y1 - 2019/2/1
N2 - This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.
AB - This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.
KW - Angular distribution
KW - Hot target
KW - Magnetron sputtering
KW - Ni film
KW - Target utilization
UR - http://www.scopus.com/inward/record.url?scp=85057755508&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85057755508&partnerID=8YFLogxK
U2 - 10.1016/j.vacuum.2018.12.001
DO - 10.1016/j.vacuum.2018.12.001
M3 - Article
VL - 160
SP - 418
EP - 420
JO - Vacuum
JF - Vacuum
SN - 0042-207X
ER -