Angular thickness distribution and target utilization for hot Ni target magnetron sputtering

This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.