Angular thickness distribution and target utilization for hot Ni target magnetron sputtering

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.

Original languageEnglish
Pages (from-to)418-420
Number of pages3
JournalVacuum
Volume160
DOIs
Publication statusPublished - 1 Feb 2019

Fingerprint

Magnetron sputtering
Sputtering
magnetron sputtering
Deposition rates
Film thickness
Magnetic fields
sputtering
film thickness
magnetic fields

Keywords

  • Angular distribution
  • Hot target
  • Magnetron sputtering
  • Ni film
  • Target utilization

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

Cite this

Angular thickness distribution and target utilization for hot Ni target magnetron sputtering. / Sidelev, Dmitrii V.; Krivobokov, Valery P.

In: Vacuum, Vol. 160, 01.02.2019, p. 418-420.

Research output: Contribution to journalArticle

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