Abstract
HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.
| Original language | English |
|---|---|
| Title of host publication | 2007 European Conference on Power Electronics and Applications, EPE |
| DOIs | |
| Publication status | Published - 1 Dec 2007 |
| Externally published | Yes |
| Event | 2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Denmark Duration: 2 Sep 2007 → 5 Sep 2007 |
Publication series
| Name | 2007 European Conference on Power Electronics and Applications, EPE |
|---|
Conference
| Conference | 2007 European Conference on Power Electronics and Applications, EPE |
|---|---|
| Country | Denmark |
| City | Aalborg |
| Period | 2.9.07 → 5.9.07 |
Fingerprint
Keywords
- Automotive application
- High temperature electronics
- Hybrid power integration
- MOSFET
- Packaging
- Power cycling
- Power semiconductor device
- Reliability
- Test bench
- Thermal stress
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
Cite this
Ageing test results of low voltage MOSFET modules for electrical vehicles. / Dupont, Laurent; Lefebvre, Stéphane; Bouaroudj, Mounira; Khatir, Zoubir; Faugières, Jean Claude; Emorine, Francis.
2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417433 (2007 European Conference on Power Electronics and Applications, EPE).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Ageing test results of low voltage MOSFET modules for electrical vehicles
AU - Dupont, Laurent
AU - Lefebvre, Stéphane
AU - Bouaroudj, Mounira
AU - Khatir, Zoubir
AU - Faugières, Jean Claude
AU - Emorine, Francis
PY - 2007/12/1
Y1 - 2007/12/1
N2 - HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.
AB - HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.
KW - Automotive application
KW - High temperature electronics
KW - Hybrid power integration
KW - MOSFET
KW - Packaging
KW - Power cycling
KW - Power semiconductor device
KW - Reliability
KW - Test bench
KW - Thermal stress
UR - http://www.scopus.com/inward/record.url?scp=51049110478&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51049110478&partnerID=8YFLogxK
U2 - 10.1109/EPE.2007.4417433
DO - 10.1109/EPE.2007.4417433
M3 - Conference contribution
AN - SCOPUS:51049110478
SN - 9075815115
SN - 9789075815115
T3 - 2007 European Conference on Power Electronics and Applications, EPE
BT - 2007 European Conference on Power Electronics and Applications, EPE
ER -