Ageing test results of low voltage MOSFET modules for electrical vehicles

Laurent Dupont, Stéphane Lefebvre, Mounira Bouaroudj, Zoubir Khatir, Jean Claude Faugières, Francis Emorine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.

Original languageEnglish
Title of host publication2007 European Conference on Power Electronics and Applications, EPE
DOIs
Publication statusPublished - 1 Dec 2007
Externally publishedYes
Event2007 European Conference on Power Electronics and Applications, EPE - Aalborg, Denmark
Duration: 2 Sep 20075 Sep 2007

Publication series

Name2007 European Conference on Power Electronics and Applications, EPE

Conference

Conference2007 European Conference on Power Electronics and Applications, EPE
CountryDenmark
CityAalborg
Period2.9.075.9.07

Fingerprint

Aging of materials
Electric potential
Failure modes
Wire
Temperature
Substrates
Hot Temperature

Keywords

  • Automotive application
  • High temperature electronics
  • Hybrid power integration
  • MOSFET
  • Packaging
  • Power cycling
  • Power semiconductor device
  • Reliability
  • Test bench
  • Thermal stress

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Dupont, L., Lefebvre, S., Bouaroudj, M., Khatir, Z., Faugières, J. C., & Emorine, F. (2007). Ageing test results of low voltage MOSFET modules for electrical vehicles. In 2007 European Conference on Power Electronics and Applications, EPE [4417433] (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417433

Ageing test results of low voltage MOSFET modules for electrical vehicles. / Dupont, Laurent; Lefebvre, Stéphane; Bouaroudj, Mounira; Khatir, Zoubir; Faugières, Jean Claude; Emorine, Francis.

2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417433 (2007 European Conference on Power Electronics and Applications, EPE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dupont, L, Lefebvre, S, Bouaroudj, M, Khatir, Z, Faugières, JC & Emorine, F 2007, Ageing test results of low voltage MOSFET modules for electrical vehicles. in 2007 European Conference on Power Electronics and Applications, EPE., 4417433, 2007 European Conference on Power Electronics and Applications, EPE, 2007 European Conference on Power Electronics and Applications, EPE, Aalborg, Denmark, 2.9.07. https://doi.org/10.1109/EPE.2007.4417433
Dupont L, Lefebvre S, Bouaroudj M, Khatir Z, Faugières JC, Emorine F. Ageing test results of low voltage MOSFET modules for electrical vehicles. In 2007 European Conference on Power Electronics and Applications, EPE. 2007. 4417433. (2007 European Conference on Power Electronics and Applications, EPE). https://doi.org/10.1109/EPE.2007.4417433
Dupont, Laurent ; Lefebvre, Stéphane ; Bouaroudj, Mounira ; Khatir, Zoubir ; Faugières, Jean Claude ; Emorine, Francis. / Ageing test results of low voltage MOSFET modules for electrical vehicles. 2007 European Conference on Power Electronics and Applications, EPE. 2007. (2007 European Conference on Power Electronics and Applications, EPE).
@inproceedings{f16726d8e6b648c6aad6005f534b855c,
title = "Ageing test results of low voltage MOSFET modules for electrical vehicles",
abstract = "HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.",
keywords = "Automotive application, High temperature electronics, Hybrid power integration, MOSFET, Packaging, Power cycling, Power semiconductor device, Reliability, Test bench, Thermal stress",
author = "Laurent Dupont and St{\'e}phane Lefebvre and Mounira Bouaroudj and Zoubir Khatir and Faugi{\`e}res, {Jean Claude} and Francis Emorine",
year = "2007",
month = "12",
day = "1",
doi = "10.1109/EPE.2007.4417433",
language = "English",
isbn = "9075815115",
series = "2007 European Conference on Power Electronics and Applications, EPE",
booktitle = "2007 European Conference on Power Electronics and Applications, EPE",

}

TY - GEN

T1 - Ageing test results of low voltage MOSFET modules for electrical vehicles

AU - Dupont, Laurent

AU - Lefebvre, Stéphane

AU - Bouaroudj, Mounira

AU - Khatir, Zoubir

AU - Faugières, Jean Claude

AU - Emorine, Francis

PY - 2007/12/1

Y1 - 2007/12/1

N2 - HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.

AB - HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions.

KW - Automotive application

KW - High temperature electronics

KW - Hybrid power integration

KW - MOSFET

KW - Packaging

KW - Power cycling

KW - Power semiconductor device

KW - Reliability

KW - Test bench

KW - Thermal stress

UR - http://www.scopus.com/inward/record.url?scp=51049110478&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=51049110478&partnerID=8YFLogxK

U2 - 10.1109/EPE.2007.4417433

DO - 10.1109/EPE.2007.4417433

M3 - Conference contribution

SN - 9075815115

SN - 9789075815115

T3 - 2007 European Conference on Power Electronics and Applications, EPE

BT - 2007 European Conference on Power Electronics and Applications, EPE

ER -