Active thermal testing of hyperthermoconductive panels

O. S. Simonova, A. O. Chulkov, V. P. Vavilov, S. B. Suntsov

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Application of active infrared thermography to assessing the internal structure and functioning of hyperthermoconductive panels used in on-board electronics is described. Effective thermal- diffusivity maps of hyperthermoconductive panels, obtained using the pulsed Parker method, are presented. The peculiarities of heat transfer in hyperthermoconductive panels are illustrated using experimental modeling in which a local thermal-load source is placed on the surface of hyperthermoconductive panels.

Original languageEnglish
Pages (from-to)453-456
Number of pages4
JournalRussian Journal of Nondestructive Testing
Volume53
Issue number6
DOIs
Publication statusPublished - 1 Jun 2017

Fingerprint

Thermal diffusivity
Thermal load
Printed circuit boards
Electronic equipment
Heat transfer
Testing
thermal diffusivity
heat transfer
Hot Temperature
electronics

Keywords

  • hyperthermoconductive panel
  • infrared thermography
  • mini-heat pipe
  • thermal diffusivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Active thermal testing of hyperthermoconductive panels. / Simonova, O. S.; Chulkov, A. O.; Vavilov, V. P.; Suntsov, S. B.

In: Russian Journal of Nondestructive Testing, Vol. 53, No. 6, 01.06.2017, p. 453-456.

Research output: Contribution to journalArticle

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