Banc de cyclage actif pour l'analyse de la fatigue thermique des brasures de composants IGBTs

Translated title of the contribution: Active cycling bench for analysis of thermal fatigue in the soldering of Insulated Gate Bipolar Transistor (IGBT) components

L. Dupont, S. Lefebvre, Z. Khatir, G. Coquery, J. C. Faugières

Research output: Contribution to journalReview article

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Engineering & Materials Science