A soft decode-compress-forward relaying scheme for cooperative wireless networks

Dushantha N K Jayakody, Mark F. Flanagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

This paper introduces a new technique for soft information relaying (SIR) which is based on a soft decode-compress-forward (DCF) relay protocol. The proposed system provides a means of using distributed low-density parity-check (LDPC) coding in conjunction with higher order (M-ary PAM) modulation, which is effective even under poor source-relay link conditions. Ordinarily, such schemes suffer from error propagation to the destination caused by incorrect decoding at the relay when the signal-to-noise ratio (SNR) on the source-relay link is low; however, our system avoids this problem by generating soft versions of the additional (parity-bearing) PAM symbols for transmission from the relay. Furthermore, we propose a new model, which we refer to as the soft scalar model, for the soft symbols generated at the relay, and we appropriately modify the log-likelihood ratio (LLR) calculation at the destination. Simulation results demonstrate that the proposed scheme can maintain very good performance under poor source-relay SNR conditions.

Original languageEnglish
Title of host publication2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages205-209
Number of pages5
ISBN (Print)9781479901227
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013 - London, United Kingdom
Duration: 8 Sep 20139 Sep 2013

Conference

Conference2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013
CountryUnited Kingdom
CityLondon
Period8.9.139.9.13

Fingerprint

Pulse amplitude modulation
Wireless networks
Signal to noise ratio
Bearings (structural)
Decoding
Modulation
Network protocols

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Jayakody, D. N. K., & Flanagan, M. F. (2013). A soft decode-compress-forward relaying scheme for cooperative wireless networks. In 2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013 (pp. 205-209). [6707865] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PIMRCW.2013.6707865

A soft decode-compress-forward relaying scheme for cooperative wireless networks. / Jayakody, Dushantha N K; Flanagan, Mark F.

2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013. Institute of Electrical and Electronics Engineers Inc., 2013. p. 205-209 6707865.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jayakody, DNK & Flanagan, MF 2013, A soft decode-compress-forward relaying scheme for cooperative wireless networks. in 2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013., 6707865, Institute of Electrical and Electronics Engineers Inc., pp. 205-209, 2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013, London, United Kingdom, 8.9.13. https://doi.org/10.1109/PIMRCW.2013.6707865
Jayakody DNK, Flanagan MF. A soft decode-compress-forward relaying scheme for cooperative wireless networks. In 2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013. Institute of Electrical and Electronics Engineers Inc. 2013. p. 205-209. 6707865 https://doi.org/10.1109/PIMRCW.2013.6707865
Jayakody, Dushantha N K ; Flanagan, Mark F. / A soft decode-compress-forward relaying scheme for cooperative wireless networks. 2013 IEEE 24th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC Workshops 2013. Institute of Electrical and Electronics Engineers Inc., 2013. pp. 205-209
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