A new approach to numerical analysis of reliability indices in electronics

Abstract

Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.

Original language	English
Title of host publication	EPJ Web of Conferences
Publisher	EDP Sciences
Volume	82
DOIs	https://doi.org/10.1051/epjconf/20158201029
Publication status	Published - 20 Jan 2015
Event	Thermophysical Basis of Energy Technologies - 2014 - Tomsk, Russian Federation Duration: 15 Oct 2014 → 17 Oct 2014

Other

Other	Thermophysical Basis of Energy Technologies - 2014
Country	Russian Federation
City	Tomsk
Period	15.10.14 → 17.10.14

ASJC Scopus subject areas

Physics and Astronomy(all)

Access to Document

10.1051/epjconf/20158201029

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Cite this

@inproceedings{d0a1984b797049dab3ec9352f0a2ba2d,

title = "A new approach to numerical analysis of reliability indices in electronics",

abstract = "Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.",

author = "Kuznetsov Geniy and Kravchenko Evgeny",

year = "2015",

month = jan,

day = "20",

doi = "10.1051/epjconf/20158201029",

language = "English",

volume = "82",

booktitle = "EPJ Web of Conferences",

publisher = "EDP Sciences",

note = "Thermophysical Basis of Energy Technologies - 2014 ; Conference date: 15-10-2014 Through 17-10-2014",

}

TY - GEN

T1 - A new approach to numerical analysis of reliability indices in electronics

AU - Geniy, Kuznetsov

AU - Evgeny, Kravchenko

PY - 2015/1/20

Y1 - 2015/1/20

N2 - Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.

AB - Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.

UR - http://www.scopus.com/inward/record.url?scp=84921819074&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84921819074&partnerID=8YFLogxK

U2 - 10.1051/epjconf/20158201029

DO - 10.1051/epjconf/20158201029

M3 - Conference contribution

AN - SCOPUS:84921819074

VL - 82

BT - EPJ Web of Conferences

PB - EDP Sciences

T2 - Thermophysical Basis of Energy Technologies - 2014

Y2 - 15 October 2014 through 17 October 2014

ER -