A new approach to numerical analysis of reliability indices in electronics

Kuznetsov Geniy, Kravchenko Evgeny

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.

Original languageEnglish
Title of host publicationEPJ Web of Conferences
PublisherEDP Sciences
Volume82
DOIs
Publication statusPublished - 20 Jan 2015
EventThermophysical Basis of Energy Technologies - 2014 - Tomsk, Russian Federation
Duration: 15 Oct 201417 Oct 2014

Other

OtherThermophysical Basis of Energy Technologies - 2014
CountryRussian Federation
CityTomsk
Period15.10.1417.10.14

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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    Geniy, K., & Evgeny, K. (2015). A new approach to numerical analysis of reliability indices in electronics. In EPJ Web of Conferences (Vol. 82). [01029] EDP Sciences. https://doi.org/10.1051/epjconf/20158201029