Abstract
Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.
| Original language | English |
|---|---|
| Title of host publication | EPJ Web of Conferences |
| Publisher | EDP Sciences |
| Volume | 82 |
| DOIs | |
| Publication status | Published - 20 Jan 2015 |
| Event | Thermophysical Basis of Energy Technologies - 2014 - Tomsk, Russian Federation Duration: 15 Oct 2014 → 17 Oct 2014 |
Other
| Other | Thermophysical Basis of Energy Technologies - 2014 |
|---|---|
| Country | Russian Federation |
| City | Tomsk |
| Period | 15.10.14 → 17.10.14 |
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ASJC Scopus subject areas
- Physics and Astronomy(all)
Cite this
A new approach to numerical analysis of reliability indices in electronics. / Geniy, Kuznetsov; Evgeny, Kravchenko.
EPJ Web of Conferences. Vol. 82 EDP Sciences, 2015. 01029.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A new approach to numerical analysis of reliability indices in electronics
AU - Geniy, Kuznetsov
AU - Evgeny, Kravchenko
PY - 2015/1/20
Y1 - 2015/1/20
N2 - Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.
AB - Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.
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UR - http://www.scopus.com/inward/citedby.url?scp=84921819074&partnerID=8YFLogxK
U2 - 10.1051/epjconf/20158201029
DO - 10.1051/epjconf/20158201029
M3 - Conference contribution
VL - 82
BT - EPJ Web of Conferences
PB - EDP Sciences
ER -