If you made any changes in Pure these will be visible here soon.

Research Output 1993 2019

Filter
Conference contribution
2019
1 Citation (Scopus)

Gate leakage-current, damaged gate and open-circuit failure-mode of recent SiC Power Mosfet: Overview and analysis of unique properties for converter protection and possible future safety management

Richardeau, F., Boige, F. & Lefebvre, S., 9 Jan 2019, 2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles and International Transportation Electrification Conference, ESARS-ITEC 2018. Institute of Electrical and Electronics Engineers Inc., 8607551. (2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles and International Transportation Electrification Conference, ESARS-ITEC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Leakage Current
MOSFET
Failure Mode
Power electronics
Silicon carbide
2018

Inverse thermal model of temperature-to-power mapping for GaN systems

Zhang, S., Laboure, E., Labrousse, D. & Lefebvre, S., 1 Jan 2018, PCIM Europe Conference Proceedings. Scharf, A. (ed.). 225809 ed. Mesago PCIM GmbH, p. 939-943 5 p. (PCIM Europe Conference Proceedings; no. 225809).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polychlorinated biphenyls
Inverse problems
Heat conduction
Thermal noise
Constrained optimization
1 Citation (Scopus)

Pcb-embedding of power dies using pressed metal foam

Pascal, Y., Labrousse, D., Petit, M., Lefebvre, S. & Costa, F., 1 Jan 2018, PCIM Europe Conference Proceedings. Scharf, A. (ed.). 225809 ed. Mesago PCIM GmbH, p. 1451-1438 14 p. (PCIM Europe Conference Proceedings; no. 225809).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Foams
Metals
Polychlorinated biphenyls
Inductance
Wire

Thermoelectric cooling for bare dies power devices embedded in pcb substrates

Zhang, S., Laboure, E., Labrousselabrousse, D. & Lefebvre, S., 1 Jan 2018, PCIM Europe Conference Proceedings. Scharf, A. (ed.). 225809 ed. Mesago PCIM GmbH, p. 1408-1415 8 p. (PCIM Europe Conference Proceedings; no. 225809).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cooling
Substrates
Polychlorinated biphenyls
Heat flux
Experiments
2017
1 Citation (Scopus)

Development of testing methods for winding turn-to-turn insulation of low voltage motors fed by PWM converters

Bolgova, V., Lefebvre, S., Hlioui, S., Boucenna, N., Costa, F. & Leonov, A., 6 Nov 2017, 2017 19th European Conference on Power Electronics and Applications, EPE 2017 ECCE Europe. Institute of Electrical and Electronics Engineers Inc., 8099363. (2017 19th European Conference on Power Electronics and Applications, EPE 2017 ECCE Europe; vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pulse width modulation
Insulation
Testing
Electric potential
Energy gap
4 Citations (Scopus)

Dispersion of electrical characteristics and short-circuit robustness of 600V E-mode GaN transistors

Landel, M., Lefebvre, S., Labrousse, D., Gautier, C., Zaki, F. & Khatir, Z., 1 Jan 2017, PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers Inc., 7990737. (PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Short circuit currents
Transistors
Robustness
Voltage
Electric potential
3 Citations (Scopus)

Estimation of the losses in Si and SiC power modules for automotive applications

Oustad, D., Lefebvre, S., Petit, M., Ameziani, M. & Lhotellier, D., 1 Jan 2017, PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers Inc., 7990929. (PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicon carbide
Silicon
Module
Insulated gate bipolar transistors (IGBT)
MOSFET
7 Citations (Scopus)

Thermal management for GaN power devices mounted on PCB substrates

Zhang, S., Laboure, E., Labrousse, D. & Lefebvre, S., 31 May 2017, 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017. Institute of Electrical and Electronics Engineers Inc., 7936752. (2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Printed circuit boards
Switching frequency
Substrates
High electron mobility transistors
Heat resistance
2016
4 Citations (Scopus)

Comparison of modeling switching losses of an IGBT based on the datasheet and an experimentation

Oustad, D., Lefebvre, S., Petit, M., Lhotellier, D. & Ameziani, M., 25 Oct 2016, 2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe. Institute of Electrical and Electronics Engineers Inc., 7695494. (2016 18th European Conference on Power Electronics and Applications, EPE 2016 ECCE Europe).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Insulated gate bipolar transistors (IGBT)
Networks (circuits)
Electric vehicles
1 Citation (Scopus)

PCB integration of a magnetic component dedicated to a power factor corrector converter

Hérault, G., Labrousse, D., Mercier, A. & Lefebvre, S., 1 Jan 2016, PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Institute of Electrical and Electronics Engineers Inc., p. 1647-1654 8 p. 7499550. (PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Corrector
Polychlorinated biphenyls
Converter
Magnetic materials
Switching frequency

Surface analysis of smart power top metal: IR thermal measurement and source potential mapping

Berkani, M., Lefebvre, S., Rostaing, G., Riccio, M., Irace, A., Ruffilli, R. & Dupuy, P., 25 Jul 2016, Proceedings of the 2016 28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016. Institute of Electrical and Electronics Engineers Inc., p. 395-398 4 p. 7520861. (Proceedings of the International Symposium on Power Semiconductor Devices and ICs; vol. 2016-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal aging
Surface analysis
Metallizing
Temperature measurement
Short circuit currents
2015
18 Citations (Scopus)

Robustness in short-circuit Mode of SiC MOSFETs

Chen, C., Labrousse, D., Lefebvre, S., Petit, M., Buttay, C. & Morel, H., 1 Jan 2015, PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of. Institute of Electrical and Electronics Engineers Inc., 7149084. (PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicon carbide
Short circuit currents
Leakage currents
Failure modes
2013
15 Citations (Scopus)

Investigation of 1.2 kV investigation of SiC MOSFETs for aeronautics applications

Othman, Lefebvre, S., Berkani, M., Khatir, Z., Ibrahim, A. & Bouzourene, A., 17 Dec 2013, 2013 15th European Conference on Power Electronics and Applications, EPE 2013. 6634665. (2013 15th European Conference on Power Electronics and Applications, EPE 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Short circuit currents
Aviation

Study on aluminum reconstruction and bond wire lift-off effects on current distribution in power semiconductor dies

Nguyen, T. A., Lefebvre, S., Joubert, P. Y., Labrousse, D. & Bontemps, S., 1 Jan 2013, Proceedings - PCIM Europe 2013: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Mesago PCIM GmbH, p. 583-590 8 p. (PCIM Europe Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallizing
Wire
Semiconductor materials
Aluminum
Aging of materials
1 Citation (Scopus)

Thermal measurement of losses of GaN power transistors for optimization of their drive

Hoffmann, L., Gautier, C., Lefebvre, S. & Costa, F., 17 Dec 2013, 2013 15th European Conference on Power Electronics and Applications, EPE 2013. 6634623. (2013 15th European Conference on Power Electronics and Applications, EPE 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Field effect transistors
Short circuit currents
Hot Temperature
Power transistors
1 Citation (Scopus)

Use of a full wave correct-by-design command to control a multilevel modular converter

Soulat, R., Herault, G., Labrousse, D., Revol, B., Feld, G., Lefebvre, S. & Fribourg, L., 17 Dec 2013, 2013 15th European Conference on Power Electronics and Applications, EPE 2013. 6634448. (2013 15th European Conference on Power Electronics and Applications, EPE 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Capacitors
Computer simulation
Experiments
2012

A measure using the eddy current technique on the effect of aluminum reconstruction in power semiconductor modules

Nguyen, T. A., Labrousse, D., Joubert, P. Y., Lefebvre, S. & Bontemps, S., 1 Dec 2012, Proceedings - PCIM Europe 2012: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. p. 757-766 10 p. (PCIM Europe Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Eddy currents
Semiconductor materials
Metallizing
Aluminum
Aluminum sheet
3 Citations (Scopus)

Application of thermoelectricity to IGBT for temperature regulation and energy harvesting

Tian, Y., Vasic, D. & Lefebvre, S., 15 Aug 2012, Proceedings - 2012 IEEE International Symposium on Industrial Electronics, ISIE 2012. p. 211-216 6 p. 6237086. (IEEE International Symposium on Industrial Electronics).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermoelectricity
Energy harvesting
Insulated gate bipolar transistors (IGBT)
Cooling systems
Temperature

Distributed and coupled electrothermal model of power semiconductor devices

Belkacem, G., Labrousse, D., Lefebvre, S., Joubert, P. Y., Kuhne, U., Fribourg, L., Soulat, R., Florentin, E. & Rey, C., 24 May 2012, 2012 1st International Conference on Renewable Energies and Vehicular Technology, REVET 2012. p. 84-89 6 p. 6195253. (2012 1st International Conference on Renewable Energies and Vehicular Technology, REVET 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallizing
Transistors
Temperature distribution
Current density
Aging of materials

Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates

Robert, C., Pommier, S., Lefebvre, S., Ortali, M. & Massiot, M., 1 Dec 2012, ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012. p. 357-365 9 p. (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012; vol. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Power electronics
Tungsten
Alumina
Networks (circuits)
Substrates
2011
8 Citations (Scopus)

Failure modes and robustness of SiC JFET transistors under current limiting operations

Bouarroudj-Berkani, M., Lefebvre, S., Othman, D., Sabrine, S. M., Khatir, Z. & Salah, T. B., 11 Oct 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications, EPE 2011. 6020356. (Proceedings of the 2011 14th European Conference on Power Electronics and Applications, EPE 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Junction gate field effect transistors
Failure modes
Transistors
Aging of materials
Short circuit currents
2009
1 Citation (Scopus)

A method to improve the reliability and the fatigue life of power device substrates

Pietranico, S., Pommier, S., Lefebvre, S. & Pattofatto, S., 1 Dec 2009, 12th International Conference on Fracture 2009, ICF-12. p. 7307-7316 10 p. (12th International Conference on Fracture 2009, ICF-12; vol. 9).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

fatigue
Fatigue of materials
copper
Copper
substrate
3 Citations (Scopus)

Indirect thermal measurement on SIC JFET transistors

Moumen, S., Lefebvre, S., Khatir, Z. & Faugières, J. C., 1 Dec 2009, 2009 13th European Conference on Power Electronics and Applications, EPE '09. 5278880. (2009 13th European Conference on Power Electronics and Applications, EPE '09).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Junction gate field effect transistors
Transistors
Temperature sensors
Hot Temperature
Heating
2008
29 Citations (Scopus)

Experimental investigations of trench field stop IGBT under repetitive short-circuits operations

Arab, M., Lefebvre, S., Khatir, Z. & Bontemps, S., 29 Sep 2008, PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. p. 4355-4360 6 p. 4592645. (PESC Record - IEEE Annual Power Electronics Specialists Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Insulated gate bipolar transistors (IGBT)
short circuits
Experimental Investigation
Short circuit currents
failure modes
5 Citations (Scopus)

Temperature levels effects on the thermo-mechanical behaviour of solder attach during thermal cycling of power electronic modules

Bouarroudj, M., Khatir, Z. & Lefebvre, S., 29 Sep 2008, PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference - Proceedings. p. 2435-2440 6 p. 4592306. (PESC Record - IEEE Annual Power Electronics Specialists Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

electronic modules
Power Electronics
Cycling
Thermal cycling
Mechanical Behavior
2007
13 Citations (Scopus)

Ageing test results of low voltage MOSFET modules for electrical vehicles

Dupont, L., Lefebvre, S., Bouaroudj, M., Khatir, Z., Faugières, J. C. & Emorine, F., 1 Dec 2007, 2007 European Conference on Power Electronics and Applications, EPE. 4417433. (2007 European Conference on Power Electronics and Applications, EPE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aging of materials
Electric potential
Failure modes
Wire
Temperature
12 Citations (Scopus)

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Bouarroudj, M., Khatir, Z., Ousten, J. P., Dupont, L., Lefebvre, S. & Badel, F., 1 Dec 2007, 2007 European Conference on Power Electronics and Applications, EPE. 4417457. (2007 European Conference on Power Electronics and Applications, EPE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Insulated gate bipolar transistors (IGBT)
Thermal cycling
Failure modes
Stress concentration
6 Citations (Scopus)

Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices

Bouarroudj, M., Khatir, Z., Lefebvre, S. & Dupont, L., 27 Nov 2007, EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. 4201184. (EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

menisci
solders
Power electronics
Soldering alloys
life (durability)
2006
9 Citations (Scopus)

Evaluation of substrate technologies under high temperature cycling

Dupont, L., Lefebvre, S., Khatir, Z. & Bontemps, S., 1 Jan 2006, 2006 4th International Conference on Integrated Power Systems, CIPS 2006. Institute of Electrical and Electronics Engineers Inc., 5758029. (2006 4th International Conference on Integrated Power Systems, CIPS 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Substrates
Metallizing
Delamination
Soldering alloys
Temperature
2005
6 Citations (Scopus)

Electrical characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications

Dupont, L., Khatir, Z., Lefebvre, S., Meuret, R., Parmentier, B. & Bontemps, S., 1 Dec 2005, 2005 European Conference on Power Electronics and Applications. 1665770. (2005 European Conference on Power Electronics and Applications; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High temperature applications
Thermal cycling
Avionics
Power electronics
Crack initiation
1994
8 Citations (Scopus)

Quantification and minimization of conducted interferences generated in hard switching and zero current switching cells

Costa, F., Laboure, E., Forest, F. & Lefebvre, S., 1 Jan 1994, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC. Publ by IEEE, p. 615-621 7 p. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Static converters
Electric power measurement
Zero current switching
1993
4 Citations (Scopus)

Maximum switching frequency choice for IGBT used in ZCS mode

Lefebvre, S., Forest, F. & Chante, J. P., 1 Dec 1993, Materials and Devices. Anon (ed.). 377 ed. Publ by IEE, p. 356-361 6 p. (IEE Conference Publication; vol. 2, no. 377).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Insulated gate bipolar transistors (IGBT)
Switching frequency
Bipolar transistors
Thyristors
Zero current switching