Engineering & Materials Science
Acoustic impedance
Aging of materials
Aluminum
Aviation
Bipolar transistors
Boundary element method
Copper
Cracks
Defects
Degradation
Diodes
Eddy currents
Electric potential
Failure modes
Fatigue of materials
High temperature applications
Hot Temperature
Insulated gate bipolar transistors (IGBT)
Junction gate field effect transistors
Leakage currents
Metal foams
Metallizing
Metals
MOSFET devices
Networks (circuits)
Oxides
Polychlorinated biphenyls
Power electronics
Power MOSFET
Power semiconductor devices
Power transistors
Printed circuit boards
Semiconductor devices
Semiconductor materials
Short circuit currents
Silicon
Silicon carbide
Soldering alloys
Substrates
Switching frequency
Temperature
Thermal aging
Thermal cycling
Thermal fatigue
Thermoanalysis
Threshold voltage
Transistors
Wire
Zero current switching
Zero voltage switching
Chemical Compounds
Aging of materials
Aluminum
Charge injection
Copper
Cracks
Defects
Degradation
Diodes
Eddy currents
Electric potential
Failure modes
Hot Temperature
Insulated gate bipolar transistors (IGBT)
Insulator Elements
Junction gate field effect transistors
Magnetic field measurement
Metal foams
Metallizing
MOSFET devices
Nanocrystalline alloys
Oxides
Power electronics
Power MOSFET
Power semiconductor devices
Power semiconductor diodes
Power transistors
Printed circuit boards
Semiconductor materials
Short circuit currents
Silicon
silicon carbide
Soldering alloys
Substrates
Temperature
Thermal aging
Thermal fatigue
Threshold voltage
Transistors
Wire
Physics & Astronomy
aeronautics
bipolar transistors
boundary element method
ceramics
characterization
chips
copper
cracks
cycles
degradation
eddy currents
electric potential
electronic modules
electronics
failure modes
field effect transistors
high temperature environments
JFET
life (durability)
metal foams
modules
performance
semiconductor devices
short circuits
silicon carbides
solders
temperature
thermal fatigue
threshold voltage
transistors
wire