Engineering & Materials Science
Insulated gate bipolar transistors (IGBT)
Short circuit currents
Aging of materials
Metallizing
Power MOSFET
Transistors
Junction gate field effect transistors
Failure modes
Power electronics
Temperature
Substrates
Hot Temperature
Silicon carbide
Thermal fatigue
Semiconductor materials
Soldering alloys
Copper
Wire
Power semiconductor devices
Degradation
Power transistors
Zero current switching
Electric potential
Silicon
Diodes
Eddy currents
Aluminum
Polychlorinated biphenyls
Thermal cycling
Metal foams
High temperature applications
MOSFET devices
Cracks
Switching frequency
Leakage currents
Networks (circuits)
Thermal aging
Threshold voltage
Metals
Acoustic impedance
Fatigue of materials
Semiconductor devices
Printed circuit boards
Boundary element method
Zero voltage switching
Oxides
Bipolar transistors
Defects
Aviation
Thermoanalysis
Chemical Compounds
Short circuit currents
Insulated gate bipolar transistors (IGBT)
Aging of materials
Power MOSFET
Metallizing
Junction gate field effect transistors
Failure modes
Substrates
Wire
Aluminum
Temperature
Transistors
silicon carbide
Power electronics
Soldering alloys
Power semiconductor devices
Degradation
Semiconductor materials
Copper
Thermal fatigue
Hot Temperature
Metal foams
Silicon
MOSFET devices
Printed circuit boards
Threshold voltage
Eddy currents
Electric potential
Diodes
Power transistors
Nanocrystalline alloys
Oxides
Insulator Elements
Cracks
Magnetic field measurement
Thermal aging
Charge injection
Defects
Power semiconductor diodes
Physics & Astronomy
short circuits
field effect transistors
failure modes
transistors
JFET
solders
cycles
chips
semiconductor devices
modules
degradation
silicon carbides
thermal fatigue
life (durability)
characterization
eddy currents
wire
bipolar transistors
electronics
threshold voltage
copper
performance
cracks
temperature
boundary element method
electronic modules
aeronautics
ceramics
electric potential
metal foams
high temperature environments